ME 5352. FUNDAMENTALS
IN ELECTRONIC PACKAGING (3-0)
An introductory treatment of electronic packaging, from single chip
to multichip, including materials, electrical design, thermal
design, mechanical design, package modeling and simulation,
processing considerations, reliability, and testing.
Prerequisite: Heat Transfer, Material Science and
ME 5353. APPLICATION OF
COMPUTATIONAL TECHNIQUES TO ELECTRONIC PACKAGING (3-0)
This course will develop the student's capability to characterize
the heat performance of electronic cooling devices by using Commercial Computational Heat Transfer Codes
like IDEAS ESC,
Icepack, FLOTHERM, CFDAce. In addition, the use of Macroflow, a network based model, for system-level thermal design
for electronics cooling will be presented. A number of
industry-related problems ranging from first-level packages through
system-level packages would be analyzed. At the end of the class, a
student is expected to formulate and model complex industry-based
problems using the commercial CFD codes. There will be frequent
industry speakers on specific projects being studied in the class.
ME 5354. FAILURES AND
THEIR PREVENTION IN ELECTRONIC PACKAGES (3-0)
A comprehensive overview of the fundamental causes for failures in
electronic assemblies which include the printed wiring board,
package, and second-level assemblies. Failure detection techniques
and methodologies, key failure analysis techniques used will be
ME 5355. MECHANICAL
FAILURE OF ELECTRONIC PACKAGES (3-0)
Failure analysis, fatigue of electronic packages, fracture and creep
behavior of solders. Mechanical properties of substrate materials.
Electromigration and failure mechanisms.
Overview of area array packaging with special emphasis on the
maturing chip scale packaging technology. Topics covered will include
the design concepts of this technology, the materials related
aspects, the manufacturing processes, and their reliability in a
variety of applications.