Dr. Wonkee Ahn
Dr. Wonkee Ahn is working as a Post-Doc under Dr. Dereje Agonafer in
Electronics, MEMS and Nanoelectronic Systems packaging center (EMNSPC),
Department of Mechanical Engineering, University of Texas at Arlington, TX since
beginning of 2006.
Dr. Ahn received his Bachelor of Science degree in mechanical engineering in
Yonsei University, Seoul, Korea in 1986. Also, he received his Master of Science
Degree at the same university in 1988. He then worked for the Samsung
electronics Co.Ltd, Production Engineering Research Center, in Suwon, Korea, as
a senior mechanical research engineer during 10 years, from 1988 to 1998.
Following that, he worked for various challenging issues related to
solid/structure mechanics, mechanical design, CAD/CAE, Manufacturing process of
product and especially lines the specific manufacturing, technologies for
Surface Mount Technique part, in same place. During work, he submitted 25
patents including 2 of international patent at U.S.A and Japan. He began work as
a full-time graduate student at The University of Texas at Arlington in 1999
under Dr. Dereje Agonafer in the EMNSPC. Dr. Ahn received his PhD degree at
mechanical engineering from the University of Texas at Arlington in December
2004. His main research topic during the education is the study of evaluation of
PWBA warpage and reliability during fabrication and reflow process and their
applications. His research interest includes computational and numerical
analysis in thermo mechanical structure, reliability in micro multilayer board
and multilayer package, device and material analysis and reliability for micro
system electronic packaging, FEA in micro electro, thermo-mechanical area, solid
mechanics, composite material. He is a member of the ASME since 1989.
E-Mail: awk3454@gmail.com