Nikhil Lakhkar

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Nikhil Lakhkar received his Bachelor's degree from Dr Babasaheb Ambedkar Marathwada University, India. He completed his Master’s degree from University of Texas-Arlington in mechanical engineering. His thesis topic was “Development of a High performance Cold plate tester apparatus.” Currently he is pursuing his Doctoral Studies under the supervision of Professor Dereje Agonafer. His experience in electronic cooling areas includes high heat flux microdevices, air cooling, liquid cooling. He worked as a co-op intern with the Advanced Thermal Laboratories at IBM in Poughkeepsie NY. His current research is “Reliability” of lead free solders.

E-Mail: nikhil.lakhakar@uta.edu

Publications:

  1. Lakhkar N.R., Hossain M.M., Viswanadham P. and Agonafer D., “Mechanical characterization of Sn-Ag-Cu solder with gold addition under tensile loading.” Accepted, InterPACK'07.
  2. Lakhkar N.R., Fasoro A., Lee W.H., Popa D., Stephanou H., and Agonafer D., “Process development and die shear testing in MOEMS packaging” Accepted, InterPACK'07.
  3. Trivedi A., Lakhkar N.R., Iyengar, M.K., Ellsworth M. Jr., Schmidt R., and Agonafer D., “Experimental and computational characterization of a heat sink tester.” Accepted, InterPACK'07.
  4. Lakhkar N.R., Iyengar M.K., Ellsworth M Jr., and Agonafer D., “Development of a high performance cold plate tester” Proceedings of ASME International Mechanical Engineering Congress and Exposition, 2005, Orlando FL.
  5. Karajgikar S., Lakhkar N.R., Schmidt R., and Agonafer D., “Impact of area contact between sensor bulb and evaporator return line on modular refrigeration unit: computational and experimental.” Journal of Heat Transfer, January 2005.
  6. Karajgikar S., Lakhkar N.R., Schmidt R., and Agonafer D., “Impact of area contact between sensor bulb and evaporator return line on modular refrigeration unit-experimental study.” ITHERM 2004, Las Vegas, NV.
  7. Lakhkar N.R., Karajgikar S., Schmidt R., and Agonafer D., “Impact of area contact between sensor bulb and evaporator return line on modular refrigeration unit-computational study.” Proceedings of ASME International Mechanical Engineering Congress and Exposition, 2003, Washington D.C.