Aalok received his Bachelor’s degree from Sardar Patel University, India. After pursuing his Bachelor’s, he worked as a Heavy Fabrication Shop Supervisor in “Larsen & Toubro Ltd.”, Hazira Works. He joined the Electronics, MEMS and Nanoelectronics Systems Packaging Center in Fall 2006 and is currently working on “Experimental and Computational Characterization of High Performance Cooling Systems” and “Mechanical Reliability Issues Related to Wire Bonded Array Package”
E-Mail: aalok_375@yahoo.com
Publications:
"Experimental and Computational Characterization of a Heat Sink Tester" InterPACK July 2007, Vancouver, B.C. (Accepted)
"Effect of Weight of Heat Sink Assembly on Mechanical Reliability of a Wire Bonded Plastic Ball Grid Array package" InterPACK July 2007, Vancouver, B.C. (Accepted)