|
Name of Student |
Title of Thesis or
Dissertation |
Date |
Degree |
|
Kaisare, A. |
Dissertation: “An Analytical and Numerical Model For
Design of Non-Uniformly Powered Silicon Chips Based on
Both Thermal and Device Clock Performance” |
2007 |
Ph.D. |
|
Krishna Teja, Chepuri |
Thesis: “Thermal enhancement of stacked dice replacing
wire bonds with through Silicon Vias at location of Die
Pads” |
2007 |
M.S. |
|
Parachuri, S. |
Thesis: “Flexible Microfluidic Circuit With Embedded
In-Plane Valve” |
2007 |
M.S. |
|
Manne Sambaiah, K. |
Thesis: “Design and Optimization of Heat Spreaders and
Selection of Fan in Laptop” |
2006 |
M.S. |
|
Sung, B.
sungbaekyoung@hotmail.com |
Thesis:Thermal Enhancement of Dies Using Thermal Vias |
2006 |
M.S. |
|
|
Parachuri, S.
srikarparuchuri@gmail.com |
Thesis: Flexible Microfluidic Circuit With Embedded
In-Plane Valve |
2006 |
M.S. |
|
Manne, S.M.K.
kranthi_manne@yahoo.com |
Thesis: Design And Optimization Of Heat Spreaders And
Selection Of Fan In Laptop |
2006 |
M.S. |
|
Bedekar, V.
vishwasbedekar@gmail.com |
Thesis: “Effect of CRAC Location on Fixed Rack Layout of
a Data Center” |
2006 |
M. S. |
|
Nikalaje, S.
suresh.nikalaje@gmail.com |
Thesis: “Development of Three Block Thermal Compact
Model and Verification of Modified Linear Superposition
Technique for Stacked Die” |
2006 |
M.S. |
|
Dewan Sandur, B.
dewan@mech.uta.edu |
Thesis: “Thermal Management of Die Stacking
Architectures Memory and Logic Processor” |
2006 |
M.S. |
|
Tadepalli, C.
chaitan_1999@yahoo.com |
Non-Thesis Project: “Effect of Weight of Heat Sink on
Mechanical Reliability of a Wire Bonded Plastic Ball
Grid Array Package” |
2006 |
M.Engr. |
|
Joseph, S.
andrewsandip@gmail.com |
Non-Thesis Project: “Air Flow Bench – Determination of
Thermal Resistance as Function of Free Stream Velocity” |
2006 |
M. Engr. |
|
Patil, A.
amit32131@yahoo.com |
Thesis: “MEMS Packaging: Fluxless Soldering and
Reliability Assessment” |
2006 |
M.S. |
|
Hossain, M.
mohammad.m.hossain@intel.com |
Dissertation: “Development of Constitutive Equations and
Methodology for Failure Prediction Models for SAC
Lead-free Alloys” |
2006 |
PhD |
|
Henderson, C.
Casey.Henderson.ext@siemens.com |
Non-Thesis
Project: “Solder
Joint Fatigue Analysis Using the Disturbed State
Concept” |
2006 |
M. Engr. |
|
Lee, Y.J.
aby0223@yahoo.com |
Non-Thesis
Project: “Thermal Reliability of 3D Stack Packaging in
Finite Element Method” |
2006 |
M. Engr. |
|
Bhat, M.
|
Non-Thesis
Project: “Implementation of Effective Lean Methodology
in the Design and Fabrication of Microprocessor Chip” |
2006 |
M. Engr. |
|
Mahur, S.
sangameshmahur@yahoo.com
|
Non-Thesis
Project: “Effect of Surface Roughness in Simulating PWB
Packages” |
2006 |
M. Engr. |
|
Zahedi, F.
fahad2220@yahoo.com |
Non-Thesis
Project: “Reliability of Lead-Free
Solder Under Cyclic Bending” |
2006 |
M. Engr. |
|
Lakhkar, N.
nikhillakhkar@yahoo.com |
Thesis: “Development of High Performance Cold Plate
Tester” |
2005 |
M.S. |
|
Kole, A.
ashutoshkole@rediffmail.com |
Thesis: “Polymer Tube Embedded in-Plane Micropump:
Design, Analysis and Fabrication” |
2005 |
M.S.
|
|
Bhopte, S.
Sbhopte1@binghamton.edu |
Thesis: “Optimization of Data Center Room Layout to
Minimize Rack Inlet Air Temperature” |
2005 |
M.S. |
|
Sethuraman, S.
Shiree_Raam@yahoo.com |
Non-Thesis Project:
“Optimization of a Finned Heat Sink for Microprocessor
Cooling” |
2005 |
M. Engr. |
|
Bhat, M.
mrmiths@hotmail.com |
Non-Thesis Project:
“Implementation of Lean Methodology in the Design and
Manufacturing of Microprocessors” |
2005 |
M. Engr. |
|
Challa, Y.
challa_yadagiri@yahoo.com |
Non-Thesis Project:
“Single Wafer Encapsulation of MEMS Device” |
2005 |
M. Engr. |
|
Prasad, Y.
yogishprasad@hotmail.com |
Non-Thesis Project:
“Simulation Methodologies for the Solder Joint Crack
Growth and Fatigue Life Prediction” |
2005 |
M. Engr. |
|
Shah, B.
bdshah@exchange.uta.edu |
Non-Thesis Project:
|
2005 |
M. Engr. |
|
Jupudi, A.
ajupudi@lytron.com |
Non-Thesis Project:
“Heat Analysis of Data Center” |
2004 |
M. Engr. |
|
Roberts, D.
Robertsdmr@cs.com |
Non-Thesis Project: “3-D Cooling
Case Study: Tessera, Inc’s PyxisTM Platform” |
2004 |
M. Engr. |
|
Devireddy, S.
devireddyshashi@yahoo.com |
Non-Thesis Project: “Role of
Electronic Packages in Cell phones & Future Direction of
Cell phone” |
2004 |
M. Engr. |
|
Shah, A. |
Non-Thesis Project: “Heat Pipe
Assisted Heat Sink Optimization of Spacing Between Heat
Pipes – A CFD Study” |
2004 |
M. Engr. |
|
Halvi, A.
a_srivatsav@hotmail.com |
Thesis: “Simulation of PWB Warpage
During Fabrication and due to reflow” |
2004 |
M.S. |
|
Akhter, R.
roksana@hotmail.com |
Thesis: “Optimal Thermal Management
of Stacked Die Package: Design for Stackability” |
2004 |
M.S. |
|
Karajgikar, S.
skarajgikar@yahoo.com |
Thesis: “Effect of
Area Contact on the Stability of Modular Refrigeration
Unit and Effect of Continuous and Discontinuous
Fabrication and Reflow Process on PWB Warpage” |
2004 |
M.S. |
|
Kuravi, S.
kusum_79@yahoo.com |
Thesis: “Estimation of Evaporation
Rates in Humid Cavities” |
2004 |
M.S. |
|
Riaz, S.
shahi.riaz@graftech.com |
Thesis: “Microchannel Liquid
Cooling System for High Heat Flux Integrated Circuits” |
2004 |
M.S. |
|
Ahn, W.
wonkee.ahn@uta.edu |
Dissertation: “Development of a
Design Tool to Assist Layout/Layup Design to Minimize
Warpage of a PWB During Fabrication and Reflow Solder
Processes " |
2004 |
Ph.D. |
|
Puppala, O. |
Non-Thesis Project: “Thermal
Analysis of Flip Chip BGA package” |
2003 |
M. Engr. |
|
Kulkarni, A.
amitikd@yahoo.com |
Thesis: “A Thermal Simulation of a
Thin Small Outline Package, Using Compact Components,
and a Study of Effect of Change in TXV Bulb Location on
the Stability of a Refrigeration System” |
2003 |
M.S. |
|
Al-Shuqairi, M.
musaalshuqairi@hotmail.com |
Thesis: “Mixed Convection of
Impinging Air Cooling Over a Parallel Plate Heat Sink” |
2003 |
M.S. |
|
Veluswamy, R.
raj5577@hotmail.com |
Thesis: “Thermal Design and
Modeling of an Improved Circuit Spot Cooler.” |
2003 |
M.S. |
|
Guggari, S.
shrishail.guggari@graftech.com |
Thesis: “A Hybrid Methodology for
Optimization of the Data Center Room Layout” |
2003 |
M.S. |
|
Jagarkal, S.
sudhakar1703@hotmail.com |
Thesis: “Optimization and
Reliability of Electronic Packages” |
2003 |
M.S. |
|
Mulay, V.
mulay@uta.edu |
Thesis: “An Experimental Study of
Effects of Thermophysical Properties of Thermostatic
Expansion Valve Sensor Bulb on Stability of
Refrigeration System” |
2003 |
M.S. |
|
Makwana, Y.
Yasin.Makwana@degreec.com |
Thesis: “Stability, Efficiency and
Control System of a Masterflux Compressor in a
Refrigeration Unit of a High End Computer” |
2003 |
M.S. |
|
Ramaswamy, K.
rk_rathinam@yahoo.com |
Non-Thesis Project: “Facility and
Equipment Thermal Guidelines for Data Center and Other
Data Processing Environments” |
2003 |
M.Engr. |
|
Rodney, R.
rgrodney@hotmail.com |
Non-Thesis Project: “An
Investigation of Friction Factors for Printed Circuit
Card Assemblies” |
2002 |
M.Engr. |
|
Bondili, V.
vjbondili@yahoo.com |
Non-Thesis Project: “Computational
Characterization of Impingement Flow in Parallel Plate
Heat Sinks” |
2002 |
M.Engr. |
|
Mustafa, W.
waqarmustafa@yahoo.com |
Non-Thesis Project: “Fracture
Mechanics Analysis of Kovar Leads” |
2002 |
M.Engr. |
|
Oprea, F.
Florin.OPREA@st.com |
Non-Thesis Project: “Thermoelectric
Breakdown of CMOS Devices” |
2001 |
M.Engr. |
|
Kaisare, A.
kaisare@mech.uta.edu |
Thesis: “A 3-Dimensional
Thermo-Mechanical Analysis of a Ball Grid Array Package” |
2001 |
M.S. |
