-
Agonafer received 2008 "Thermi" Award
-
Thompson receives 2007-2008 UT Arlington Outstanding Employee of the Year Award
-
Agonafer becomes AAAS Fellow
-
Agonafer Presents Seminars on Two Continents
-
Dr. S.W. Ricky Lee, Electronic Packaging Laboratory, Center for Advanced Microsystems Packaging, Hong Kong University of Science & Technology, "Multi-Stacked Flip Chips with Copper Plated Through Silicon Vias for 3D System-in-Package Integration"