received 2008 "Thermi" Award
UT Arlington Outstanding Employee of the Year Award
Presents Seminars on Two Continents
Dr. S.W. Ricky Lee, Electronic
Packaging Laboratory, Center for Advanced Microsystems Packaging, Hong
Kong University of Science & Technology,
"Multi-Stacked Flip Chips with Copper Plated Through Silicon Vias for
3D System-in-Package Integration"